AV800-D27-A45S4 IP65 Military Server Xeon D-2796NT w/ GPU

7StarLake

Designed to meet MIL-810, MIL-461 EMC/EMI, IP65 Sealed with External Cooling Blade

Key Features:

  • Ultra High-Performance Intel Xeon Ice Lake-D, D-2796NT (20xCores)
  • NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
  • MIL-STD 810 Thermal, Vibration, Shock, Humidity
  • 1x 25GbE SFP28, 1x10GbE, 2x 1GbE LAN
  • Up to 512GB LRDIMM/256GB RDIMM
  • 2x NVMe PCIe Gen 4.0 U.2
  • Dual Removable Anti-Drop Solid-State Disk
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810 Thermal, Shock, Vibration, Humidity
  • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
  • Extreme Temperature Support -20~+60°C

In stock

SKU
AV800-D27-A45S4

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Description / AV800-D27-A45S4 IP65 Military Server Xeon D-2796NT w/ GPU

Artificial intelligence (AI) is quickly becoming one of the most crucial elements of business success. Today, deploying powerful computing platforms that can accelerate and scale their AI-based products and services while adapting them to harsh environments has become vital for many successful military applications.

7Starlake is innovating to address the emerging high-throughput inference market driven by IoT devices generating huge amounts of data. The combination of NVIDIA Tensor RT and the new architecture-based GeForce Accelerator is ideal for demanding and latency-sensitive workloads.

Key Features:

  • Ultra High-Performance Intel Xeon Ice Lake-D, D-2796NT (20xCores)

  • NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA

  • MIL-STD 810 Thermal, Vibration, Shock, Humidity

  • 1x 25GbE SFP28, 1x10GbE, 2x 1GbE LAN

  • Up to 512GB LRDIMM/256GB RDIMM

  • 2x NVMe PCIe Gen 4.0 U.2

  • Dual Removable Anti-Drop Solid-State Disk

  • IP65 Sealed with External Cooling Blade

  • MIL-STD-810 Thermal, Shock, Vibration, Humidity

  • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)

  • Extreme Temperature Support -20~+60°C

More Information

brand 7StarLake
Specifications

Processor

Intel® Xeon® D-2796NT, 20core, 40 thread, 30MB Cache, 2.0/3.1GHz. Single socket FCBGA-2579 , up to 120W TDP

Memory type

64GB RDIMM ECC DDR4-3200/2933 MT/s,

Up to 512GB in 4 DIMM Slot

Chipset

Intel® SoC Integrated

GPU

1x NVidia® RTX A4500, 5888 CUDA Cores, PCIe Gen4.0 x16

Display

VGA, Resolution up to 1920x1200@60Hz 32bpp

Chipset

Aspeed AST2600 BMC

Ethernet Controller

25G SFP28 LAN via SoC

10G LAN via Intel® X550

Gigabit LAN via Intel®i350

LAN

2x 1GBase-T, 1x 10GBase-T Lan, 1x 25GBase SFP

Storage

1x M.2 NVMe 2TB M2. 2280 SSD

2x U.2 NVMe 8TB 2.5” SSD hot-swap

Power Type

18V~36V DV Input

Dimension

405 mm x 316 mm x 204.8 mm (W x L x H)
Front I/O
X1 1x CAN BUS TVS07RF-9-98S connector
X2 1x 10GbE(SFP+) LCFTV70NN connector
X3 1x 10GbE TVSS07RF-11-35SA connector
X4 1x DC-IN TV07RW-13-4P connector
X5 4x RS232/422/485 24FD35SN connector
X6 1x GbE TVS07RF-11-35S-LC connector
X7 1x GbE TVS07RF-11-35S-LC connector
X8 1x USB3.0 USB3FTV7AZNF312 connector
X9 1x VGA D-sub 15 connector with waterproof cap
Environmental

MIL-STD-810 Test

Method 500.5, Procedures I and II (Altitude, Operation):

12,192 M, (40,000 ft) for the initial cabin altitude (18.8 Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9 Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 509.7 Salt Spray (50±5)g/L

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 4, Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24, Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Reliability

Conduction Cooling.

Designed and manufactured using ISO 9001 Certified Quality Program

MIL-STD-461

CE102 basic curve, 10 kHz - 30 MHz

RE102-4, (1.5 MHz) -30 MHz - 5 GHz

RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10 V/m, EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC

MIL-STD-1275

Steady State – 20V~33V,

Surge Low – 18V/500ms,

Surge High – 100V/500ms

Emitted spikes

Injected Voltage surges

Emitted voltage surges

Voltage ripple (2V)

Voltage spikes

Starting Operation

Reverse polarity

Operating Temp.

-20 to +60°C

Storage Temp.

-40 to +85°C

Relative Humidity

5% to 95%, non-condensing

Operating System

Operating System

Windows 10 64Bit, Linux by option

RoHS

RoHS compliant
Description

Artificial intelligence (AI) is quickly becoming one of the most crucial elements of business success. Today, deploying powerful computing platforms that can accelerate and scale their AI-based products and services while adapting them to harsh environments has become vital for many successful military applications.

7Starlake is innovating to address the emerging high-throughput inference market driven by IoT devices generating huge amounts of data. The combination of NVIDIA Tensor RT and the new architecture-based GeForce Accelerator is ideal for demanding and latency-sensitive workloads.

Key Features:

  • Ultra High-Performance Intel Xeon Ice Lake-D, D-2796NT (20xCores)

  • NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA

  • MIL-STD 810 Thermal, Vibration, Shock, Humidity

  • 1x 25GbE SFP28, 1x10GbE, 2x 1GbE LAN

  • Up to 512GB LRDIMM/256GB RDIMM

  • 2x NVMe PCIe Gen 4.0 U.2

  • Dual Removable Anti-Drop Solid-State Disk

  • IP65 Sealed with External Cooling Blade

  • MIL-STD-810 Thermal, Shock, Vibration, Humidity

  • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)

  • Extreme Temperature Support -20~+60°C
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