MTE670T & MTE670T-I PCIe M.2 SSDs (128GB/256GB/512GB/1TB)
PCIe M.2 SSDs with 3D NAND technology
In stock
- SKU
- TSXXXXMTE670T/-I
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Description / MTE670T & MTE670T-I PCIe M.2 SSDs (128GB/256GB/512GB/1TB)
Transcend's M.2 SSD MTE670T incorporates cutting-edge 3D NAND technology, allowing 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough significantly increases storage efficiency as compared to 3D NAND at 96 layers. To achieve previously unheard-of transfer speeds, the MTE670T has a PCI Express (PCIe) Gen 3 x4 interface that is compatible with NVM Express (NVMe) 1.3 requirements. The MTE670T, which uses a 30" gold finger PCB with Corner Bond technology, is thoroughly tested in-house to ensure dependability in mission-critical applications. It has a 3K Program/Erase cycle endurance rating and an extended operating temperature range of -20°C to 75°C. For mission-critical applications, Transcend additionally provides the MTE670T-I with wide temperature capabilities (-40°C to 85°C). This ensures continued operation, increased durability, and ideal reliability.
Key Features:
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- SLC caching technology
- Built-in LDPC ECC (Error Correction Code) functionality
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Advanced Garbage Collection
- Advanced Global Wear-Leveling and Block management for reliability
More Information
| Specifications |
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| Description |
Transcend's M.2 SSD MTE670T incorporates cutting-edge 3D NAND technology, allowing 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough significantly increases storage efficiency as compared to 3D NAND at 96 layers. To achieve previously unheard-of transfer speeds, the MTE670T has a PCI Express (PCIe) Gen 3 x4 interface that is compatible with NVM Express (NVMe) 1.3 requirements. The MTE670T, which uses a 30" gold finger PCB with Corner Bond technology, is thoroughly tested in-house to ensure dependability in mission-critical applications. It has a 3K Program/Erase cycle endurance rating and an extended operating temperature range of -20°C to 75°C. For mission-critical applications, Transcend additionally provides the MTE670T-I with wide temperature capabilities (-40°C to 85°C). This ensures continued operation, increased durability, and ideal reliability. Key Features:
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