VTC7260-x Fanless AI-Aided Vehicle Computer

Nexcom

Fanless AI-aided Vehicle Computer with Intel Core 11th Gen CPU

Key Features:

  • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
  • Compact, rugged and fanless design
  • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
  • Triple display, VGA, HDMI and DP for multi video-out
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -30°C~65°C (15W TDP)
  • Military standard of anti-vibration/shock for OHV applications
  • CE/FCC, UKCA, Emark Certified

In stock

SKU
VTC7260-x

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Description / VTC7260-x Fanless AI-Aided Vehicle Computer

The VTC7260-x is an in-vehicle AI-aided telematics computer built with Intel's 11th generation Tiger Lake UP3, which has 25% more computing capacity than the previous generation. Additionally, its strategy of a 10-year product life-cycle can provide long-term support appropriate for any in-vehicle applications. With its small, tough, and fanless design, the VTC 7260-x can be easily installed in any cabinet with limited room, reducing maintenance requirements while providing round-the-clock services. The VTC 7260-x is a complex in-vehicle computer that also includes a variety of peripherals, such as 2.5GbE, USB 3.2, isolation CANBus, serial ports, ultra-speed NVMe storage, triple displays, audio in/out, DI/DO, and 936VDC with IGN control.

The user can install Hailo AI accelerator (26TOPS) and LTE/5G/Wi-Fi 5/6 modules to operate as the edge AI and implement cloud SaaS-based AI services. Given its use in harsh environments, the VTC 7260-x complies with MIL-STD-810G's anti-vibration and shock requirements and can work in a temperature range of -30°C to 65°C (15W TDP). VTC 7260-x complies with the law's requirements for CE/FCC Class A, UKCA, and EMARK. (E13).

Key Features:

  • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
  • Compact, rugged and fanless design
  • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
  • Triple display, VGA, HDMI and DP for multi video-out
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -30°C~65°C (15W TDP)
  • Military standard of anti-vibration/shock for OHV applications
  • CE/FCC, UKCA, Emark Certified

More Information

brand Nexcom
Specifications
CPU
  • Intel® Core™ 11th Gen Tiger Lake UP3
  • Core i5-1145GRE, base frequency 1.5GHz/ 2.6GHz, 4c, 8 MB Intel® Smart Cache (VTC 7260-5)
  • Core i7-1185GRE, base frequency 1.8GHz/ 2.8GHz, 4c, 12 MB Intel® Smart Cache (VTC 7260-7)
  • Graphics:
    - Intel® Iris® Xe graphics, 1.3GHz
    - Max resolution: 4096 x 2304@60Hz (HDMI)
    - DirectX: 12.1, OpenGL: 4.6
Memory
  • 2 x SO-DIMM, DDR4-3200MHz
  • 4GB+4GB in default, 64GB in max.
  • ECC (in-band ECC), dual-channel support
Storage
  • 1 x 2.5” SSD (15mm height)
  • 1 x mPCIe for mSATA (SATA 3.0)
  • 1 x M.2 2242/2280 Key M NVMe SSD (PCIe 4.0x4), Hailo AI card in option
Expansion slots
  • 1 x mPCIe socket (PCIe 3.0 + USB 2.0/ USB 3.2), 2 x micro SIMs supported
  • 1 x M.2 3042/3052 Key B socket (USB 3.2), 2 x micro SIMs supported
  • 1 x M.2 2230 Key E socket (PCIe 3.0 x2 & USB 2.0), Wi-Fi or Hailo AI card in option
Display
  • 1 x HDMI 2.0a/b, up to 3840 x 2160@60Hz
  • 1 x VGA, up to 2560 x 1600@60Hz
  • 1 x DP, 4096 x 2304@60Hz
2.5GbE
  • 2-port independent 2.5GbE, RJ45 connector
    - 9K byte jumbo frame
    - PTP (IEEE 1588) support
    - Controller: Intel® I225-IT
GbE
  • 1-port independent GbE, RJ45 connector
    - vPro (iAMT) support
    - 9K byte jumbo frame
    - PTP (IEEE 1588) support
    - Wake-up function (WoL)
    - Boot from PXE (UEFI)
USB
  • 3 x USB3.2 Gen1:
    - Host type-A connector
    - 5V@900mA each
    - Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed)
  • 1 x USB 2.0, host type-A, 2 x USB 2.0
Serial Port
  • 2 x full RS232/422/485, selectable
  • 1 x full RS232, 1 x full RS232 wafer-type reserved
    - RS232 working voltage, +- 9V, baud rate up to 115.2kb/s
Security
  • TPM 2.0: Infineon SLB9665TT2.0FW5.62
Audio
  • Line-out, unbalance stereo, left & right channel
  • MIC-in, stereo
  • Line-in reserved (wafer connector)
MEMS Sensor
  • 3D accelerometer and 3D gyroscope
  • Controller: ST LSM6DSLTR
DI/DO
  • 4-bit input
    - Source: 9~36VDC (12V@1.1mA/24V@2.2mA)
    - External: 0~33VDC pull-high, high-level, 3.3-33 VDC; low-level, 0-2VDC
  • 4-bit output
    - Source: 9~36VDC (nominal 35mA@24V):
    - External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)
  • Source or external can be selected by DIP switch (default: source type)
CAN bus
  • 1 x CAN 2.0A/ 2.0B
  • IEC 61000-4-2 Electrostatic Discharge (ESD): ± 8KV/15KV (contact/air)
  • 2.5KV isolated
GNSS
  • U-blox NEO-M9N GNSS module for GPS/GLONESS/QZSS/Galileo/Beidou
  • Optional DR (Dead Reckoning) function, NEO-M8U/M8L
Power Supply
  • Nominal voltage: 9~36V
  • Cranking voltage: 6V~9V (less than 20 sec)
  • OCP & UVP (shut down once exceeding 37V)
  • Ignition on/off control & programmable on/off delay timer
  • Optional for remote power on/off control
I/O ports, Front-plate
  • ATX power button, Reset button
  • 9 x LED Indicators, 1 x VGA (DB15), 2 x COM (DB9, RS232/422/485), 1 x Multi-port (DB15, 4xDI, 4xDO, CAN, DR signal) , 1 x Ext. (DB15, reserved), 1 x PR-SMA for GNSS, 4 x PR-SMA for WLAN
I/O ports, Rear-plate
  • 2 x Audio jack (Line-out & MIC-in)
  • 3 x USB 3.2 type A, 1 x USB 2.0 type A
  • 1 x HDMI, 1 x DP, 4 x PoE+ (2.5GbE, RJ45), 1 x COM (DB9, RS232), 1 x GbE, 9~36VDC (3-pin Phoenix), 4 x SMA for WWAN, 4 x antenna holes reserved
I/O ports, side-plate
  • 2 x SIM slots (SIM1-1, SIM2-1)
Dimensions & Weight
  • 210.0mm x 173.0mm x 75.0mm (w/o mount brackets)
  • 234.0mm x 173.0mm x 81.0mm (w/ mount brackets)
  • Weight: 3.5kg
Environment
  • Operating temperatures: -30°C~65°C (15W TDP)
  • Storage temperatures: -40°C~85°C
  • Relative humidity: 10%~95% (non-condensing)
Vibration & Shock
  • Vibration in operating:
    - MIL-STD-810H, 514.8C Procedure 6, Category 4
    - IEC 60068-2-64: 2.0g@5~500Hz
  • Vibration in storage:
    - MIL-STD-810G, 514.6E Procedure 1, Category 24, 7.7g
  • Shock:
    - MIL-STD-810G, 516.6 Procedure I, trucks and semi-trailers=40g
    - Crash hazard: Procedure V, ground equipment=75g
Certifications
  • CE approval, FCC Class A, UKCA, E13 Certified
Operating System
  • Windows 10 64-bit/Windows 10 IOT 64-bit, Windows 11
  • Linux (Ubuntu 18.04)
External Cable (option)
  • DB15 multi-port adapter cable, 20cm
Description

The VTC7260-x is an in-vehicle AI-aided telematics computer built with Intel's 11th generation Tiger Lake UP3, which has 25% more computing capacity than the previous generation. Additionally, its strategy of a 10-year product life-cycle can provide long-term support appropriate for any in-vehicle applications. With its small, tough, and fanless design, the VTC 7260-x can be easily installed in any cabinet with limited room, reducing maintenance requirements while providing round-the-clock services. The VTC 7260-x is a complex in-vehicle computer that also includes a variety of peripherals, such as 2.5GbE, USB 3.2, isolation CANBus, serial ports, ultra-speed NVMe storage, triple displays, audio in/out, DI/DO, and 936VDC with IGN control.

The user can install Hailo AI accelerator (26TOPS) and LTE/5G/Wi-Fi 5/6 modules to operate as the edge AI and implement cloud SaaS-based AI services. Given its use in harsh environments, the VTC 7260-x complies with MIL-STD-810G's anti-vibration and shock requirements and can work in a temperature range of -30°C to 65°C (15W TDP). VTC 7260-x complies with the law's requirements for CE/FCC Class A, UKCA, and EMARK. (E13).

Key Features:

  • Intel 11th Gen Tiger Lake UP3, cost-efficient performance
  • Compact, rugged and fanless design
  • Rich I/Os, 2 x 2.5GbE, GbE, 4 x USB 3.2/2.0 & 3 x RS232/422/485
  • 1 x 2.5” SSD, 1 x mSATA and 1 x NVMe SSD for data integrity
  • Up to 3 combinations of LTE/5G, and Wi-Fi 5/6 for mobile router function
  • Triple display, VGA, HDMI and DP for multi video-out
  • 9~36V DC-IN with ignition control & OCP/OVP
  • Wide range operating temperature of -30°C~65°C (15W TDP)
  • Military standard of anti-vibration/shock for OHV applications
  • CE/FCC, UKCA, Emark Certified
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Datasheet

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